- China Semi Equipment: Research reveals a significant uptick in revenue for China’s top chip equipment manufacturers during the first half of the year. This trend underscores Beijing’s ongoing commitment to achieving self-reliance within the semiconductor sector. The top 10 domestic equipment manufacturers collectively recorded a notable year-on-year revenue increase of 39%, amassing approximately 16.2 billion Chinese yuan ($2.2 billion). These findings originate from research conducted by Shanghai-based CINNO Research.
- Japan Subsidies: To fortify domestic semiconductor supply chains, the Japanese government has decided to expand subsidies directed towards TSMC and the Western Digital/Kioxia joint venture. As reported by Nikkei, TSMC is poised to receive subsidies of up to ¥476 billion ($3.2 billion), while the WDC/Kioxia JV is slated to receive up to ¥93 billion ($620 million).
- Korean Semis: The United States is expected to grant an indefinite extension of a waiver to South Korean chip manufacturers, Samsung and SK Hynix. This waiver allows them to supply equipment necessary for chip production in China without the requirement for additional licenses. This extension follows the authorization granted by the U.S. Commerce Department last year, enabling these chipmakers to serve the Chinese market without additional licensing hurdles.
- Intel: Intel has announced the commencement of mass production for its Intel 4 node, incorporating Extreme Ultraviolet (EUV) technology, at its facility in Ireland.
- Microchip: Microchip has unveiled nine new technology and application-specific solution stacks, catering to its expanding mid-range FPGA and SoC portfolio. These innovations span across edge computing, smart embedded vision, and edge communications.
- Micron: Micron has declared its intent to invest up to $3.3 billion in next-generation 1-gamma process technology over the coming years, featuring EUV technology. The production of Micron’s 1-gamma node is scheduled to commence in Japan by 2025, with anticipation of government support.
- Nvidia: Reports emanating from Asia suggest that Nvidia has initiated orders with TSMC for its forthcoming Blackwell architecture, utilizing 3nm manufacturing technology. The first chip, codenamed GB100, is expected to cater to high-performance computing (HPC) and artificial intelligence (AI) applications. Subsequently, a chip named GH100 is anticipated for use in Hopper cards.
- NPX: NXP anticipates introducing its initial automotive-grade 5nm chips, produced by TSMC, to automakers by 2025. This development represents a substantial upgrade from the prevailing 16nm technology in NXP’s existing microcontroller range.
- Single Board Computers: Raspberry Pi has launched its 5th generation of Single Board Computers (SBCs), featuring enhanced speed, dual 4Kp60 display capabilities, PCIe interface, and an onboard real-time clock.
- Samsung Foundry: Samsung Foundry has experienced a decline in the utilization of its 8-inch wafer processing due to diminished demand. Consequently, Samsung has recently implemented a 10% price reduction for its 8-inch wafer services. Reports also indicate that SK Hynix’s foundry is grappling with similar challenges. Samsung’s 8-inch foundry primarily produces Power Management Integrated Circuits (PMICs), panel driver ICs, and Microcontroller Units (MCUs).
- US Semi Industry: A recent study conducted by the Semiconductor Industry Association (SIA) in collaboration with Oxford Economics forecasts an increase in employment within the semiconductor sector to approximately 460,000 by the end of the decade, up from roughly 345,000 at present. Nonetheless, this growth may still fall short of meeting the total demand for qualified professionals within the industry, leaving a projected shortage of 67,000 workers by 2030. This projection suggests that a substantial portion of chip factory technician positions may remain vacant.
- Qualcomm: The UK’s Competition and Markets Authority (CMA) has announced an upcoming investigation into Qualcomm’s proposed acquisition of Autotalks, an Israel-based automotive chip manufacturer.
- TSMC: TSMC has amplified its orders for Chip on Wafer on Substrate (CoWoS) equipment by 30% to address the mounting demand for artificial intelligence (AI) solutions from Nvidia, AMD, and Amazon. Reports indicate that Nvidia commands a significant share of TSMC’s CoWoS capacity, estimated at 60%, with AMD, Amazon, and Broadcom occupying the remainder. TSMC aims to expand its monthly CoWoS capacity from 12,000 units to a range of 25,000 to 30,000 units.
- TSMC 2nm Delay: According to reports from TechNews in Asia, there is speculation about a potential delay in TSMC’s 2nm manufacturing process, with a projected rollout in 2026. This delay may present an opportunity for Intel, which has positioned its 18A process—equivalent to 2nm technology—as manufacturing-ready in the second half of 2024. Intel’s 18A process features Gate-All-Around (GAA) transistors and is currently progressing at a pace approximately six months ahead of the 2nm process.”
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