AMD – AMD announced plans to invest $135M in Ireland for strategic R&D. AMD is making this push in Ireland to expand its adaptive computing research, development and engineering operations in the country.
Amkor – Amkor announced plans to invest $800M in 2023 in new equipment and technology for high-tech packaging solutions. Investments are expected to be focused on Amkor’s new Vietnam capacity which is planned to start production in 4Q23.
ASML – The Dutch government is planning to publish new export controls that will restrict more of ASML Holding NV’s chipmaking machines from being sent to China as soon as next week, according to a report by Bloomberg. The restrictions are expected to prevent shipments of ASML’s DUV models. ASML is already prohibited from selling its EUV machines to Chinese customers.
Cisco – Cisco announced a new networking chip dubbed SiliconOne for AI supercomputers that would compete with offerings from Broadcom and Marvell. Cisco said the chip is
currently being tested by five of the six major cloud service providers.
Delta Electronics – Taiwan’s Delta Electronic plans to
acquire the German HY&T for $142M. Delta says the key
driver of the purchase is the TB&C subsidiary, which builds automotive high-voltage hybrid components. The deal expects to boost its presence in the fast-growing EV space.
Micron – Micron announced it would invest up to $825 million in a new chip assembly and test facility in Gujarat, India, its first factory in the country. Micron said that with support from the Indian central government and from the state of Gujarat, the total investment in the facility will be $2.75 billion. Of that total, 50% will come from the Indian central government and 20% from the state of Gujarat.
Mobile semis – China’s mobile phone sales during the 618 shopping festival were disappointing, prompting Qualcomm and MediaTek to reduce wafer starts at foundries and lower chip prices, according to DigiTimes citing industry sources.
Foundry – According to South Korean media the foundry market is expected to bottom in 2Q and a recovery in demand is projected for the 2H. The report states TSMC is expected to see recovery in 2H driven by AI demand from Nvidia. The articles citing sources says UMC and S. Korean
foundry are projecting a similar tone for a 2H recovery.
Memory – Samsung and SK Hynix have asked the U.S. government to consider an “indefinite exemption” from export controls to China, according to S. Korean media, which will allow them to export U.S.-made equipment to factories in China. The program is designed to reduce the licensing burden on industry by allowing U.S. exporters to ship designated items to pre-approved entities under a general authorization, rather than multiple separate export licenses.
Intel – Intel announced it will spend more than 30 billion euros ($33 billion) to develop two chip-making plants in Magdeburg as part of its expansion push in Europe. Berlin has agreed subsidies worth nearly 10 billion euros with the U.S. chipmaker, more than the 6.8 billion euros it had initially offered. Intel’s announcement follows TSMC from earlier this year to invest 10 billion euros on fab in Dresden. Reports from Asia highlight TSMC expressing concerns about securing labor to run its fab in Germany, particularly
mid-level and high-level talent.
Intel – Intel announced plans to invest $25B fab in Israel in Kiryat Gar where Intel already has a fab. The new fab is expected to become operational in 2027. The Israel government is expected to provide $3.2B of subsidies.
ROHM – ROHM Semiconductor has announced a long-term silicon carbide (SiC) supply partnership (2024 to 2030) worth over $1 billion with Vitesco Technologies, a manufacturer of modern drive technology and electrification solutions. According to the announcement, Vitesco will begin supplying traction inverters with integrated ROHM SiC chips to at least two automotive customers starting in 2024.
ST Micro – Airbus and STMicroelectronics have signed an agreement to cooperate on power electronics R&D to support more efficient and lighter power electronics for future hybrid-powered aircraft and full-electric urban air vehicles. The collaboration builds on evaluations already conducted by both companies to explore the benefits of wide bandgap semiconductor materials for aircraft electrification.
